Electromagnetic simulation to predict EMC immunity behavior of an aeronautic board

Nowadays, the obsolescence of an electronic component is solved by trial and error approach: the component is changed by another equivalent one and EMC requirement is checked. Integrated Circuit obsolescence is an economic constraint for electronic suppliers. In order to consider the obsolescence on electronic components, it is necessary to establish a methodology aiming to guarantee the non-regression of EMC performances of equipment during an immunity test. We propose a new methodology to predict immunity of component during the electronic board design. The component model developed is based on EMC measurement. The authors compare measurements with simulations using the proposed model and demonstrate the validity of this approach.