New EMC-testing-method for smart sensors during for IC-design-process

Electronic systems generated much innovation of automotive development in recent years. The number of integrated sensor-systems is rising significantly faster compared to other electronics in automotive applications. Miniaturization and integration limit space for conventional solutions of robustness against electro-magnetic fields. To achieve robustness for Electromagnetic Compatibility (EMC) of highly integrated sensors-systems is becoming more and more challenging. To proof EMC conform design at an early stage of development and to finally to meet customer-requirements. This paper introduces a new approach of engineering measurements by modulated radio frequency (rf) signals. It is intended to increase measurement-accuracy on chip-level and to save test time. The first step is to describe different noise-parameters of modern digital Integrated Circuits (IC / ASIC). Based on this knowledge parameters of frequency-modulated (FM) signals are chosen. By the study of different errors in test devices, represented by smart sensor devices in system-on-a-chip (SOC) and systems-in-package (SIP), the advantage and usability of the introduced test-method is pointed out and compared to conventional EMC-testing on chip-level.