DocumentCode
128157
Title
On dealing with low frequency problems using MoM and dielectrics in a simplified IEMI scenario
Author
Francavilla, Matteo A. ; Righero, Marco ; Vecchi, Giuseppe ; Vipiana, Francesca
Author_Institution
Ist. Superiore Mario Boella, Turin, Italy
fYear
2014
fDate
1-4 Sept. 2014
Firstpage
1228
Lastpage
1231
Abstract
Some preliminary results are shown about the application to the case of dielectric and metallic object of a multiresolution change of basis to deal with the low-frequency breakdown appearing in the surface integral equation formulation of electromagnetic modelling. The main effect of the change of basis is to allow a simple diagonal preconditioner to become very effective, with respect to the analogous application without the change of basis. The idea, developed for the case of impenetrable objects treated with the Electric Field Integral Equation, is here applied to the case of penetrable objects as well, treated with the standard Poggio-Miller-Chang-Harrington-Wu-Tsai formulation. The effects on the condition number of the system resulting to the application of the Method of Moments, on the convergence path of an iterative solver, on the global error and on the error on the induced current in a simplified IEMI scenario are presented.
Keywords
dielectric materials; electric breakdown; electric field integral equations; electromagnetic interference; iterative methods; metals; method of moments; IEMI scenario; MoM; Poggio-Miller-Chang-Harrington-Wu-Tsai formulation; diagonal preconditioner; dielectric object; electric field integral equation; electromagnetic modelling; intentional electromagnetic interference; iterative solver; low-frequency breakdown; metallic object; method of moments; surface integral equation formulation; Dielectrics; Electromagnetic compatibility; Europe; Integral equations; Method of moments; Standards; Strips; HPEM; IEMI; Method of Moments; critical infrastructure; low-frequency breakdown;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC Europe), 2014 International Symposium on
Conference_Location
Gothenburg
Type
conf
DOI
10.1109/EMCEurope.2014.6931092
Filename
6931092
Link To Document