Title :
Failure prediction and health prognostics of electronic components: A review
Author :
Bhargava, Chitresh ; Banga, Vijay Kumar ; Singh, Yogang
Author_Institution :
Lovely Prof. Univ., Phagwara, India
Abstract :
The Rapid evolution of electronics device technology towards low cost and high performance, the electronics products become more complex, higher in density and speed, and lighter for easy portability. In modern competitive market, low cost and high performance are the key factors to attract the customers towards their products. Growing system complexity demands robust control to mitigate system control and disturbances. As more and more components are integrated on to a single chip, the probability of damage is increased, as the different components have different characteristics and different operating conditions. So a condition monitoring techniques are employed which embraces a knowledge of failure mechanism of individual part or integrated system, and diagnosis the health condition of a system in real time such that if it drifts from scheduled outcomes, an appropriate action to be taken before serious deterioration or breakdown occurs. The electronic system needs a fault prediction methodology to prevent the system from accidental failure and discrepancies. In this paper, different failure prediction methods have been discussed. For an efficient working of system, it is the prime requirement to analyze reliability prediction of electronic components along with life cycle costs.
Keywords :
condition monitoring; electronic products; failure analysis; probability; accidental failure; condition monitoring techniques; electronic system; electronics device technology; electronics products; failure mechanism; failure prediction and health prognostics; fault prediction methodology; life cycle costs; probability of damage; reliability prediction analysis; robust control; system complexity demands; system control mitigation; Condition monitoring; Consumer electronics; Electronic components; Physics; Predictive models; Reliability; Artificial Intelligence; Condition Monitoring; Failure Prediction; Physics of Failure (PoF); Reliability;
Conference_Titel :
Engineering and Computational Sciences (RAECS), 2014 Recent Advances in
Conference_Location :
Chandigarh
Print_ISBN :
978-1-4799-2290-1
DOI :
10.1109/RAECS.2014.6799572