Title :
Hierarchical interconnection technology
Author_Institution :
McMurdo Instrument Company Ltd., Portsmouth, UK
fDate :
9/1/1986 12:00:00 AM
Abstract :
Surface-mount assembly and component packaging techniques pose a considerable challenge to the future of interconnection. As a consequence an entirely new system is envisaged¿hierarchical interconnection technology (HIT)
Journal_Title :
Electronics and Power
DOI :
10.1049/ep.1986.0392
