• DocumentCode
    1282279
  • Title

    Interconnect Network Analysis of Many-Core Chips

  • Author

    Balakrishnan, Anant ; Naeemi, Azad

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • Volume
    58
  • Issue
    9
  • fYear
    2011
  • Firstpage
    2831
  • Lastpage
    2837
  • Abstract
    This paper presents the first intercore interconnect technology optimization and wiring demand calculation for mesh, concentrated mesh, flattened butterfly, and concentrated flattened butterfly network-on-chip topologies. Global wire dimensions are optimized to achieve maximum bandwidth and minimum delay. The core-to-core channel width is then determined by taking into account the available wiring area and area occupied by the router within each core. It is shown that the router area limits the channel width for all topologies. In mesh and concentrated mesh topologies, a smaller channel width results in underutilization of the available wiring area; less than 10% of the area available in two orthogonal wiring levels if the router area is constrained to 20% of the core area. For flattened butterfly and concentrated flattened butterfly topologies, the required wiring areas can be as high as 80% of two orthogonal wiring levels for the same routing area constraint. However, flattened butterfly topology does not scale for a larger number of cores due to the rapid increase in the number of ports and, consequently, router area.
  • Keywords
    integrated circuit interconnections; network analysis; network-on-chip; wiring; concentrated flattened butterfly network-on-chip topology; concentrated mesh topology; core-to-core channel width; global wire dimensions; interconnect network analysis; intercore interconnect technology; many-core chips; orthogonal wiring levels; routing area constraint; wiring demand calculation; Bandwidth; Delay; Integrated circuit interconnections; Optimization; Topology; Wires; Wiring; Circuit optimization; delay estimation; multiprocessor interconnections; routing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2011.2158104
  • Filename
    5961614