Title :
Versatile patterning process for semiconductors based on microcontact printing
Author :
Schmidt, G. ; Tormen, M. ; Müller, G. ; Molenkamp, L.W. ; Chen, Y. ; Lebib, A. ; Launois, H.
Author_Institution :
Phys. Inst., Wurzburg Univ., Germany
fDate :
9/30/1999 12:00:00 AM
Abstract :
A new patterning process based on the microcontact printing of self-assembled monolayers on gold is presented. The method is readily adapted to processes utilising standard optical or electron beam resists, and is fully compatible with industrial semiconductor fabrication technology. The process can also be applied to surfaces which exhibit extreme nonplanarity such as sharp edges of mesas or etch grooves
Keywords :
gold; lithography; monolayers; printing; semiconductor technology; silicon; Au; Si; electron beam resist process; etch grooves; industrial semiconductor fabrication technology; mesa edges; microcontact printing; nonplanar surfaces; optical resist process; patterning process; self-assembled monolayers; semiconductor patterning;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19991072
