DocumentCode
1282453
Title
Thin-Film Piezoelectric MEMS Transducer Suitable for Middle-Ear Audio Prostheses
Author
Campanella, Humberto ; Camargo, Carlos J. ; García, Javier López ; Daza, Alberto ; Urquiza, Rafael ; Esteve, Jaume
Author_Institution
Inst. de Microelectron. de Barcelona, Centro Nac. de Microelectron. (Consejo Super. de Investig. Cientificas), Barcelona, Spain
Volume
21
Issue
6
fYear
2012
Firstpage
1452
Lastpage
1463
Abstract
We report a thin-film piezoelectric microelectromechanical systems (MEMS) transducer suitable for in vivo implantation as audio prosthesis and a method for fabricating it. The transducer consists of a layered stack of thin films comprising a MEMS membrane made of an isolating oxide interface; two platinum (Pt) layers acting as electrodes, electrical paths, and contacting pads; a thin-film sputtered aluminum nitride (AlN) layer acting as acoustic active material of the transducer; a passivation layer for device protection; and a 3-D micromachined acoustic cavity fabricated on the bulk of a silicon-on-insulator supporting substrate. The transducer has a reduced size and a low cost associated with CMOS-like mass production. Finite-element modeling and experimental tests conducted at the audio and ultrasonic bands show that the device has the performance required in audio prosthesis applications. The technology offers possibilities for biocompatibility or biocompatible packaging and is integrable to microelectronic circuit technologies.
Keywords
bioMEMS; biomedical transducers; finite element analysis; hearing; microfabrication; piezoelectric thin films; piezoelectric transducers; prosthetics; thin film circuits; 3D micromachined acoustic cavity; MEMS membrane; MEMS transducer fabrication; acoustic active material; audio band; audio prosthesis applications; biocompatibility; biocompatible packaging; contacting pads; electrical paths; finite element modeling; in vivo implantation; isolating oxide interface; layered thin film stack; microelectromechanical systems; microelectronic circuit technologies; middle ear audio prostheses; passivation layer; platinum electrode layers; silicon on insulator supporting substrate; thin film piezoelectric MEMS transducer; thin film sputtered aluminum nitride layer; ultrasonic band; Acoustics; Aluminum compounds; Electrodes; Implantable biomedical devices; Micromechanical devices; Piezoelectric transducers; Prosthetics; Substrates; Transducers; Aluminum nitride (AlN) devices and transducers; implantable audio prostheses; microelectromechanical systems (MEMS) transducer; piezoelectric transducers;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2012.2211571
Filename
6297427
Link To Document