• DocumentCode
    1283
  • Title

    Efficient DC Analysis of Power Planes Using Contour Integral Method With Circular Elements

  • Author

    Xiaomin Duan ; Bruns, Heinz-Dietrich ; Schuster, Christian

  • Author_Institution
    Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
  • Volume
    3
  • Issue
    8
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    1409
  • Lastpage
    1419
  • Abstract
    Contour integral method, well-known for the analysis of 2-D full-wave effects on power planes, is extended here for the computation of DC resistances of power planes. In particular, circular elements, e.g., vias and antipad holes, are treated using cylindrical modal expansion functions, which leads to a more efficient and accurate calculation than the conventional implementation by the linear discretization. For individual power planes, the method produces a resistor network consisting of only the nodes that are associated with power or ground vias, which can be further employed to formulate solutions for complete multilayer structures. The method is applied to several power plane configurations and results are validated by a 3-D finite element method solver. The efficiency of the extended method is analyzed and a reduction of the number of unknowns by a factor of four for the circular elements can be expected by the modal expansion. Good accuracy can be achieved by including up to the second higher order mode for dense clusters of antipad holes.
  • Keywords
    electric resistance; finite element analysis; integral equations; printed circuits; vias; 2D full wave effects; 3D finite element method solver; DC resistances; antipad holes; circular elements; contour integral method; cylindrical modal expansion functions; dense clusters; linear discretization; power planes; resistor network; Computer integrated manufacturing; Equations; Harmonic analysis; Resistance; Resistors; Testing; Vectors; Contour integral method; IR drop; modal expansion; power integrity; printed circuit board; signal integrity;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2264838
  • Filename
    6544255