Title :
Large core (/spl sim/60 μm) SOI multimode waveguides for optical interconnect
Author :
Eng, T.T.H. ; Ho, J.Y.L. ; Chan, P.W.L. ; Kan, S.C. ; Wong, G.K.L.
Author_Institution :
Dept. of Phys., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
Abstract :
Multimode integrated optical waveguides, with single-crystal silicon as the core material and a core thickness as large as 60 μm, are fabricated on thick-film bond-and-etched-silicon-on-insulator substrates. The loss coefficient at the wavelength of 1310 nm is measured to be 0.8 dB/cm. The fabrication process is based on the mature silicon IC technology and is very cost-effective. A simple multimode waveguide coupler is demonstrated.
Keywords :
integrated circuit packaging; integrated circuit technology; integrated optics; optical fabrication; optical interconnections; optical losses; optical waveguides; silicon-on-insulator; substrates; 1310 nm; 60 mum; SOI multimode waveguides; Si; core material; core thickness; cost-effective; fabrication process; large core; loss coefficient; mature silicon IC technology; multimode integrated optical waveguides; multimode waveguide coupler; optical interconnect; single-crystal silicon; thick-film bond-and-etched-silicon-on-insulator substrates; Bonding; Integrated optics; Loss measurement; Optical device fabrication; Optical interconnections; Optical losses; Optical materials; Optical waveguides; Silicon; Wavelength measurement;
Journal_Title :
Photonics Technology Letters, IEEE
