• DocumentCode
    1284397
  • Title

    Linewidth enhancement factor and high temperature performance of 1.48 μm strained InGaAs-InGaAsP multiquantum well laser

  • Author

    Dutta, Niloy K. ; Olsson, N. Anders ; Temkin, Henry K. ; Logan, Ralph A. ; Tanbun-Ek, T.

  • Author_Institution
    AT&T Bell Lab., Murray Hill, NJ, USA
  • Volume
    27
  • Issue
    3
  • fYear
    1991
  • fDate
    3/1/1991 12:00:00 AM
  • Firstpage
    678
  • Lastpage
    680
  • Abstract
    The linewidth enhancement factor α in strained InGaAs-InGaAsP multiquantum well (MQW) lasers emitting near 1.48 μm has been experimentally determined. The measured α at the lasing wavelength is found to be 2 compared to a value of 5.5 and 3.5 typically observed in InGaAsP-InP regular double heterostructure (DH) lasers and MQW lasers, respectively. The small α shows that single wavelength strained MQW lasers have smaller chirp width under modulation and also smaller CW linewidth. The carrier lifetime at threshold in these strained MQW lasers does not decrease as rapidly with increasing temperature as is observed for regular InGaAsP-InP DH lasers. This indicates a smaller nonradiative carrier loss due to Auger recombination in strained quantum wells
  • Keywords
    III-V semiconductors; gallium arsenide; gallium compounds; indium compounds; semiconductor junction lasers; spectral line breadth; 1.48 micron; Auger recombination; InGaAs-InGaAsP; MQW lasers; carrier lifetime; high temperature performance; laser threshold; lasing wavelength; linewidth enhancement factor; nonradiative carrier loss; semiconductors; smaller CW linewidth; smaller chirp width; strained InGaAs-InGaAsP multiquantum well laser; Charge carrier density; Chirp; Indium gallium arsenide; Laser theory; Optical device fabrication; Quantum well devices; Quantum well lasers; Refractive index; Semiconductor lasers; Temperature;
  • fLanguage
    English
  • Journal_Title
    Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9197
  • Type

    jour

  • DOI
    10.1109/3.81376
  • Filename
    81376