• DocumentCode
    1284661
  • Title

    Improvement of Film-to-Substrate Adhesion for Diamond and Related Films by Plasma-Based Technologies

  • Author

    Ma, Lei ; Yu, Xiang ; Peng, Zhijian ; Fu, Zhiqiang ; Yue, Wen ; Wang, Chengbiao ; Hua, Meng

  • Author_Institution
    Sch. of Eng. & Technol., China Univ. of Geosci. Beijing, Beijing, China
  • Volume
    39
  • Issue
    11
  • fYear
    2011
  • Firstpage
    3072
  • Lastpage
    3079
  • Abstract
    Diamond films become an ideal candidate for tool-coating materials because of its unique properties: 1) highest hardness and heat conductivity; 2) a low friction coefficient; and 3) good chemical stability. Due to their high hardness and toughness, cemented-carbide tools coated with diamond have profound potential applications in industries and currently drawn intensive attention among the academics worldwide. However, the poor adhesion inhered between a diamond coating and a cemented carbide shortens the working life and jeopardizes the tooling accuracy of the coated tools. This paper attempts to reveal systemically some mechanisms likely causing the poor adhesion, illuminates and compares some approaches by using energetic particles to form a multilayered gradient coating system so as to improve the adhesion, which demonstrates certain superior merits.
  • Keywords
    adhesion; cermets; coatings; cutting tools; diamond; explosives; friction; hardness; plasma materials processing; thermal conductivity; thin films; C; cemented-carbide tools; chemical stability; diamond films; film-to-substrate adhesion; friction coefficient; hardness; heat conductivity; multilayered gradient coating; plasma-based technology; tool-coating materials; Adhesives; Cobalt; Diamond-like carbon; Rough surfaces; Substrates; Surface roughness; Surface treatment; Adhesion; cemented carbide; diamond film; plasma-based technology;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2011.2160461
  • Filename
    5963728