• DocumentCode
    1285012
  • Title

    Device sensitivity of field-plated polysilicon high-voltage TFTs and their application to low-voltage operation

  • Author

    Huang, Tiao-Yuan ; Wu, I-Wei ; Lewis, Alan G. ; Chiang, Anne ; Bruce, Richard H.

  • Author_Institution
    Xerox Palo Alto Res. Center, CA, USA
  • Volume
    11
  • Issue
    11
  • fYear
    1990
  • Firstpage
    541
  • Lastpage
    543
  • Abstract
    The device sensitivity to the offset length variations in the recently proposed field-plated (FP) polysilicon high-voltage thin-film transistor (HVTFT) has been studied. The device characteristics of the new FP-HVTFTs are found to be much more immune to misalignment errors; this is a very desirable feature, especially for large-area applications. FP-HVTFTs also exhibit lower leakage current than their conventional counterparts for up to 100-V operation. At typical low-voltage operation (e.g. 20 V), an improvement of about three orders of magnitude in the on/off current ratio can be readily achieved. These features, together with the simpler processing and improved turn-on characteristics reported earlier, make the FP-TFT a very promising device architecture for large-area microelectronics.<>
  • Keywords
    elemental semiconductors; insulated gate field effect transistors; leakage currents; semiconductor technology; silicon; thin film transistors; 100 V; 100-V operation; 20 V; FP-HVTFTs; application; device characteristics; device sensitivity; field plated high-voltage thin-film transistors; immune to misalignment errors; improved turn-on characteristics; large-area applications; large-area microelectronics; leakage current; low-voltage operation; offset length variations; on/off current ratio; polycrystalline Si; simpler processing; Dielectric substrates; Fabrication; Implants; Leakage current; Microelectronics; Polymer films; Printers; Thin film devices; Thin film transistors; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.63026
  • Filename
    63026