DocumentCode :
1285446
Title :
Recent development of high energy density polymers for dielectric capacitors
Author :
Wang, Yong ; Zhou, Xin ; Chen, Qin ; Chu, Baojin ; Zhang, Qiming
Author_Institution :
Electr. Eng. Dept., Pennsylvania State Univ., University Park, PA, USA
Volume :
17
Issue :
4
fYear :
2010
fDate :
8/1/2010 12:00:00 AM
Firstpage :
1036
Lastpage :
1042
Abstract :
High energy density dielectric materials are desirable for capacitors and other energy storage systems. Two approaches were developed to achieve high electric energy density: explore high dielectric constant (K) materials and improve high operation electric field. Relaxor ferroelectric polyvinylidene fluoride (PVDF) based copolymers P(VDF-HFP), P(VDF-CTFE) and terpolymer P(VDF-TrFE-CFE) have been proven to possess high electric energy density. An energy density of over 25 J/cm3 has been achieved in PVDF-based polymers, which represents the state of art in high energy density polymers. Aromatic polyurea thin films were developed through vapor phase deposition, exhibiting relatively high dielectric constant, low loss, high breakdown field (>800 MV/m) and consequently high energy density (>12 J/cm3). Its thermal stability up to 200 °C and high charge-discharge efficiency (>90%) make it attractive for high temperature capacitors. Investigation through SEM, AFM and other experiments indicated unbalanced aromatic polyurea could exhibit apparent high-K (~15) due to the non-uniformity of film thickness and surface morphology. This article reviews the recent development of these high performance polymers.
Keywords :
Art; Capacitors; Dielectric constant; Dielectric materials; Dielectric thin films; Electric breakdown; Energy storage; Ferroelectric materials; Films; High-K gate dielectrics; Plastics; Polymer films; Relaxor ferroelectrics; Sputtering; Temperature measurement; Dielectric materials, capacitors, energy storage, polymers, PVDF,; aromatic polyurea;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2010.5539672
Filename :
5539672
Link To Document :
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