• DocumentCode
    1285492
  • Title

    Foreword contributions from the 1998 intersociety conference on thermal and thermomechanical phenomena in electronic packages

  • Author

    Ramakrishna, K. ; Sammakia, Bahgat G. ; Subbarayan, Ganesh ; Mirman, B.

  • Author_Institution
    Motorola, Inc.
  • Volume
    22
  • Issue
    4
  • fYear
    1999
  • Firstpage
    481
  • Lastpage
    483
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.1999.814961
  • Filename
    814961
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1285492