DocumentCode :
1285492
Title :
Foreword contributions from the 1998 intersociety conference on thermal and thermomechanical phenomena in electronic packages
Author :
Ramakrishna, K. ; Sammakia, Bahgat G. ; Subbarayan, Ganesh ; Mirman, B.
Author_Institution :
Motorola, Inc.
Volume :
22
Issue :
4
fYear :
1999
Firstpage :
481
Lastpage :
483
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.1999.814961
Filename :
814961
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1285492
