Numerical analysis of fine lead bonding-effect of pad mechanical properties on interfacial deformation

Author

Takahashi, Yasuo ; Inoue, Michinobu ; Inoue, Katsunori

Author_Institution

Joining & Welding Res. Inst., Osaka Univ., Japan

Volume

22

Issue

4

fYear

1999

fDate

12/1/1999 12:00:00 AM

Firstpage

558

Lastpage

566

Abstract

The present study was carried out for the purpose of understanding solid state inner and middle lead bonding, especially the effect of pad mechanical properties on the interfacial deformation processes between lead and pad based on a computer simulation that was carried out by using a finite element method (FEM). As the mechanical properties largely depend on temperature, we discuss the influence of temperature on the effect of pad mechanical properties, i.e., the pad temperature is different from the lead temperature. It is suggested that the interfacial extension reaches greater than 20% for only 10% lead reduction as the pad temperature is 200 K higher than the lead temperature. We further discuss the effect of the substrate temperature on the bond strength, based on the calculated and experimental results

Keywords

deformation; digital simulation; finite element analysis; integrated circuit packaging; lead bonding; bond strength; computer simulation; fine lead bonding; finite element method; inner lead bonding; interfacial deformation; interfacial extension; middle lead bonding; pad mechanical properties; pad temperature; substrate temperature; Atherosclerosis; Bonding processes; Capacitive sensors; Deformable models; Gold; Lead; Mechanical factors; Numerical analysis; Stress; Temperature dependence;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.814972

Filename

814972