• DocumentCode
    1285589
  • Title

    Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: transducer selection

  • Author

    Canumalla, Sridhar

  • Author_Institution
    Sonoscan Inc., Grove Village, IL, USA
  • Volume
    22
  • Issue
    4
  • fYear
    1999
  • fDate
    12/1/1999 12:00:00 AM
  • Firstpage
    582
  • Lastpage
    592
  • Abstract
    The lateral resolution of broadband transducers commonly used in acoustic microscopy is discussed in the context of selecting optimum transducers to make images for the best possible resolution of defects in plastic encapsulated integrated circuit (IC) packages. A predictive model to accurately calculate the effective lateral resolution afforded by a transducer is proposed. The model, which explicitly considers the measured frequency dependent attenuation behavior in water and in encapsulant materials, is a practical tool for the acoustic microscopist interested in selecting a transducer with optimum characteristics for inspecting a particular IC package. Experimental data from plastic quad flat packages (PQFP´s) molded with two different encapsulants-Nitto MP8000CH and Sumitomo 6300HJ are presented to demonstrate the validity of the modeling approach. Recommendations for optimum transducer selection are presented based on a parametric study of the effect of various transducer and material parameters on the effective lateral resolution and signal loss
  • Keywords
    acoustic microscopy; acoustic transducers; encapsulation; integrated circuit testing; plastic packaging; acoustic microscopy; broadband transducers; encapsulated ICs; frequency dependent attenuation behavior; lateral resolution; material parameters; plastic encapsulated integrated circuit; signal loss; transducer selection; Acoustic measurements; Acoustic transducers; Attenuation measurement; Frequency measurement; Image resolution; Integrated circuit modeling; Microscopy; Particle measurements; Plastic integrated circuit packaging; Predictive models;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.814975
  • Filename
    814975