DocumentCode
1285838
Title
Improving Diagnosis Through Failing Behavior Identification
Author
Yu, Xiaochun ; Blanton, Ronald D.
Author_Institution
Intel Corp., Hillsboro, OR, USA
Volume
31
Issue
10
fYear
2012
Firstpage
1614
Lastpage
1625
Abstract
Logic diagnosis analyzes the observed failing circuit responses to derive the potential defect sites. This paper describes a method for improving diagnosis through failing behavior identification (FBI). FBI captures defect behavior (i.e., activation conditions of the defect) by identifying the signal lines related to defect activation. This additional information allows the root cause to be estimated in order to improve yield, design quality, and test quality, as well as guide PFA to perform faster defect localization. FBI is accomplished by: 1) deriving the neighborhood states of the defect site, i.e., the actual values on the signal lines within logical or physical proximity to the defect site, and 2) identifying the signal lines that are most relevant to defect activation. The efficacy of FBI is validated using circuit-level and logic-level simulation experiments. The results show that FBI achieves an average accuracy of 94% in identifying signal lines that are relevant to defect activation, a 28% improvement over an existing approach. Moreover, by analyzing the neighborhood states of each defect site reported by logic diagnosis, sites that are not likely to be defective can be eliminated, which leads to improvement in diagnosis resolution. Experiment results show that with little influence on diagnosis accuracy, the number of incorrect defective sites reported by logic diagnosis can be reduced by 64%, on average.
Keywords
integrated circuit testing; logic design; logic testing; activation conditions; circuit-level simulation experiments; defect activation; defect localization; design quality; failing behavior identification; logic diagnosis; logic-level simulation experiments; observed failing circuit response; potential defect sites; signal lines; test quality; yield; Bridge circuits; Circuit faults; Entropy; Feature extraction; Integrated circuit modeling; Layout; Object recognition; Candidate isolation; IC testing; defect behavior; failure diagnosis; multiple defect; physical failure analysis;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2012.2196278
Filename
6303946
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