• DocumentCode
    128710
  • Title

    A high step-up DC-DC converter with intermediate capacitor and coupled inductors

  • Author

    Farooq, Ahmed ; Chao He ; Henglin Chen ; Guozhu Chen

  • Author_Institution
    Coll. of Electr. Eng., Zhejiang Univ., Hangzhou, China
  • fYear
    2014
  • fDate
    9-11 June 2014
  • Firstpage
    1791
  • Lastpage
    1797
  • Abstract
    In this paper a high step-up interleaved boost converter is proposed for renewable energy applications. The proposed converter uses multi-phase/interleaving technique with two coupled inductors in one phase and an intermediate capacitor between the two phases. The idea is such that the coupled inductors are used to develop a high voltage across the intermediate capacitor and then this high voltage is transferred to the output to achieve a high step-up voltage gain with appropriate duty cycle. The operating principle and steady state analysis of the converter are discussed in detail which shows several advantages over a traditional interleaved boost converter. These advantages include a very high voltage conversion ratio and reduction in the voltage stress of the transistor switches. A simulation has been carried out for proposed converter as well as conventional interleaved boost converter (IBC) to verify the performance of the proposed converter. Finally a 32-W, 20-V input, 160-V output laboratory prototype is built and tested to verify simulation results and effectiveness of the proposed converter.
  • Keywords
    DC-DC power convertors; capacitors; inductors; IBC; coupled inductors; high step-up DC-DC converter; high step-up interleaved boost converter; high step-up voltage gain; intermediate capacitor; renewable energy applications; transistor switches; Capacitors; DC-DC power converters; Inductors; MOSFET; Simulation; Stress; Switches; Boost converter; Coupled Inductors; Interleaved; Switch Stress; Voltage conversion ratio; formatting;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics and Applications (ICIEA), 2014 IEEE 9th Conference on
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-4799-4316-6
  • Type

    conf

  • DOI
    10.1109/ICIEA.2014.6931458
  • Filename
    6931458