Title :
High-performance double-modulation-doped InAlAs/InGaAs/InAs HFETs
Author :
Xu, D. ; Heiss, H. ; Kraus, Sarit ; Sexl, M. ; Bohm, G. ; Trankle, G. ; Weimann, G. ; Abstreiter, G.
Author_Institution :
Walter-Schottky Inst., Tech. Univ. Munchen, Germany
fDate :
7/1/1997 12:00:00 AM
Abstract :
We demonstrate the improvement of double-sided-doped InAlAs/InGaAs MODFETs by inserting a thin InAs layer in the center of the conventional InGaAs channel. A maximum extrinsic transconductance of 1.4 S/mm is achieved for 0.13-μm devices. The current gain cutoff frequency of this device is as high as 265 GHz. Delay time analysis shows a significant improvement in the effective saturated velocity, from 2.4×10/sup 7/ cm/s for LM devices to 3.1×10/sup 7/ cm/s for InAs devices. We believe the superior performance of this device is primarily due to the reduction of scattering from donor layers, especially under the channel, and the interface roughness, which is achieved by inserting a 4-nm InAs layer in the channel.
Keywords :
III-V semiconductors; Shubnikov-de Haas effect; aluminium compounds; delays; gallium arsenide; high electron mobility transistors; indium compounds; millimetre wave field effect transistors; 0.13 mum; 1.4 S/mm; 265 GHz; 4 nm; InAlAs-InGaAs-InAs; current gain cutoff frequency; delay time analysis; donor layer scattering reduction; double-modulation-doped InAlAs/InGaAs/InAs HFETs; double-sided-doped InAlAs/InGaAs MODFETs; effective saturated velocity; interface roughness; maximum extrinsic transconductance; millimeter-wave power application; thin InAs layer insertion; Cutoff frequency; Doping; Electrons; Fabrication; HEMTs; Indium compounds; Indium gallium arsenide; MODFETs; Scattering; Transconductance;
Journal_Title :
Electron Device Letters, IEEE