DocumentCode
1287515
Title
Development of Optical MUX/DEMUX on Silicon Optical Bench—Assembly Accuracies
Author
Tan, Chee-Wei ; Lim, Teck-Guan ; Li, Jing ; Endrio, Tangdiongga Geri ; Chai, Yi-Yoon ; Maruo, Seiji ; Ramana, Pamidighantam V. ; Yoon, Seung-Wook ; Lau, John H.
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Volume
32
Issue
3
fYear
2009
Firstpage
650
Lastpage
656
Abstract
An optical subassembly of MUX/DEMUX where optical devices are hybrid-integrated on a silicon optical bench (SiOB) using a passive alignment method is reported. A tight tolerance of positional and tilting angular accuracy is required for optical devices attachment in order to maximize the coupling efficiency. The critical positioning transverse to the optical axis merely depends on the symmetry, and accuracy of the position and shape of trenches. Any inaccuracy primarily affects the noncritical positioning, i.e., z-axis and thetas z, in the direction along the optical axis; misalignment accumulated and causes undesired insertion loss. All the piece parts, i.e., mirror, thin-film filters (TFFs), ball lens, SiOB, etc., have a defined tolerance in their dimensions and surfaces which increases the challenge in achieving high placement accuracy along the optical axis. The effects from these inherent inaccuracies of the position and shape of trenches and piece parts could be minimized by optimizing the adhesive volume, improve the bottom flatness, proper procedure selection. Misalignment at each axis, e.g., x-, y-, z-, thetas x, thetas y, and thetas z was characterized and its effect to the coupling efficiency was discussed.
Keywords
light transmission; packaging; silicon-on-insulator; transceivers; coupling efficiency; optical MUX/DEMUX; passive alignment method; silicon optical bench-assembly accuracies; Insertion loss; Lenses; Mirrors; Optical coupling; Optical devices; Optical films; Optical filters; Optical losses; Shape; Silicon; Accuracy; adhesive; coupling efficiency; passive alignment; silicon optical bench;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2009.2024693
Filename
5191303
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