Abstract :
The subject of silicon microsystems is reviewed from a device manufacturing viewpoint. Techniques taken straight from the integrated-circuit industry were the starting point for this work. Because of the 3D nature of microsystems, different processes have been developed to fully exploit the potential of this field, particularly in substrate etching and lithography. The paper explores the developments that have been made in this area, and how it is likely that microelectronics and microsystems, from a manufacturing point of view, will diverge even further in the future
