DocumentCode :
1287840
Title :
Mind the gap! Electronics and communications in the engineering continuum
Author :
O´Reilly, John
Volume :
11
Issue :
6
fYear :
1999
fDate :
12/1/1999 12:00:00 AM
Firstpage :
271
Lastpage :
278
Abstract :
Real-world problems do not respect the boundaries of engineering or established academic disciplines. This is illustrated by examples drawn from four broad research themes: the information society, sustainable development, transport studies and healthcare engineering. These unquestionably represent some of the major challenges of the day. The author argues that a holistic interdisciplinary approach, with electronics and communications playing a seminal role in the engineering continuum, has enabled real and substantive advances to be made, the total achievements being far more than the sum of the parts
Keywords :
biomedical electronics; biomedical engineering; electronics industry; health care; information technology; prosthetics; telecommunication services; transportation; communications; electronic chip implants; electronics; global telecommunications; healthcare engineering; information society; research; sustainable development; transport studies;
fLanguage :
English
Journal_Title :
Electronics & Communication Engineering Journal
Publisher :
iet
ISSN :
0954-0695
Type :
jour
DOI :
10.1049/ecej:19990607
Filename :
815894
Link To Document :
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