DocumentCode
1287841
Title
The Effect of Self-Heating in LDMOSFET Expansion Regime
Author
Chou, Hsueh-Liang ; Ng, Jacky C W ; Liou, Ruey-Hsin ; Jong, Yu-Chang ; Tuan, Hsiao-Chin ; Huang, Chih-Fang ; Gong, Jeng
Author_Institution
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
59
Issue
11
fYear
2012
Firstpage
3042
Lastpage
3047
Abstract
In this paper, it is the first time that the effect of self-heating of LDMOS transistors operating in the so-called expansion regime of the output characteristics is studied. Experimental characterization and numerical simulations are used to demonstrate that, in order to explain the origin of the current enhancement phenomenon observed in the output characteristics of LDMOS transistors biased at high gate and drain voltages (which is named as the expansion regime), the thermal effect of the device self-heating, in addition to the proposed intrinsic MOSFET saturation, has to be considered. This is supported by analyzing the temperature, charged carrier velocity, impact ionization rate, and electric field at different positions in the LDMOS transistors biased at different gate and drain voltages.
Keywords
MOSFET; impact ionisation; LDMOS transistor; LDMOSFET expansion regime; charged carrier velocity; drain voltage; electric field; gate voltage; impact ionization rate; self-heating effect; temperature; thermal effect; Impact ionization; Isothermal processes; Logic gates; MOSFET circuits; Temperature; Temperature measurement; Transistors; Current enhancement; Kirk effect; LDMOS; expansion regime; impact ionization; isothermal simulation; nonisothermal simulation; reduced surface field (RESURF); self-heating; thermal effect;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2012.2214036
Filename
6307837
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