• DocumentCode
    128807
  • Title

    Multi-scale modeling of oxygen vacancies assisted charge transport in sub-stoichiometric TiOx for RRAM application

  • Author

    Pirrotta, O. ; Padovani, A. ; Larcher, Luca ; Zhao, Lu ; Magyari-Kope, B. ; Nishi, Yoshio

  • Author_Institution
    DISMI - Dept. of Sci. & Methods for Eng., Univ. of Modena & Reggio Emilia, Reggio Emilia, Italy
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    37
  • Lastpage
    40
  • Abstract
    In this work we investigate the charge transport in sub-stoichiometric TiOx for RRAM applications. We explored the atomic defect configurations actively assisting the charge transport in sub-stoichiometric TiOx through a multi-scale approach. We combined density-functional-theory-based non-equilibrium Green´s function approach (DFT_NEGF) with physical-based trap assisted tunneling (TAT) modeling to identify the defects dominating the current conduction mechanism and the physical parameters of the defects responsible for the trap-assisted tunneling (TAT). The values of the thermal ionization energy ET and relaxation energy EREL extracted are 0.35-0.4eV and 0.7eV, respectively.
  • Keywords
    Green´s function methods; density functional theory; ionisation; random-access storage; stoichiometry; titanium compounds; tunnelling; DFT-NEGF; RRAM applications; TAT modeling; TiOx; atomic defect configurations; charge transport; conduction mechanism; defect identification; density-functional-theory-based nonequilibrium Green function approach; electron volt energy 0.35 eV to 0.4 eV; electron volt energy 0.7 eV; multiscale modeling; oxygen vacancies; physical parameters; physical-based trap assisted tunneling modeling; relaxation energy; resistive random access memories; substoichiometry; thermal ionization energy; Couplings; Discrete Fourier transforms; Electron traps; Lattices; Temperature; Tin; Tunneling; DFT; Marcus theory; NEGF; RRAM; TiOx; Trap Assisted Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931557
  • Filename
    6931557