Title :
A novel duality-based modeling methodology for reverse current-voltage characteristics of SiC
Author :
Yamamoto, Takayuki ; Sawai, Tetsuro ; Mizutani, Keiichi ; Otsuka, N. ; Fujii, Eiji ; Horikawa, Nobuyuki ; Kanzawa, Yuchi
Author_Institution :
Device Solutions Center, Panasonic Corp., Kadoma, Japan
Abstract :
This paper presents a novel methodology to design a compact but precise SPICE (Simulation Program with Integrated Circuit Emphasis) model which reproduces complete current-voltage (I-V) characteristics of Silicon Carbide (SiC) power devices. The methodology is based on duality relation between one function for the forward I-V characteristics and its inverse function for the reverse I-V characteristics. The simulated and the measured results of static characteristics of DioMOS (Diode integrated SiC MOSFET) have proved that the reverse I-V characteristics are reproduced by the inverse function of the forward I-V characteristics. Moreover, universal applicability of the proposed methodology is proved by other commercially supplied SiC power devices as well.
Keywords :
MOSFET; SPICE; duality (mathematics); silicon compounds; wide band gap semiconductors; DioMOS; SPICE model; SiC; SiC power devices; diode integrated SiC MOSFET; duality relation; forward I-V characteristics; inverse function; reverse I-V characteristics; reverse current-voltage characteristics; silicon carbide power devices; simulation program with integrated circuit emphasis model; Current measurement; Integrated circuit modeling; Logic gates; MOSFET; SPICE; Semiconductor device modeling; Silicon carbide; SPICE model; SiC MOSFET; body diode; channel diode; reverse currennt-voltage characteristics;
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location :
Yokohama
Print_ISBN :
978-1-4799-5287-8
DOI :
10.1109/SISPAD.2014.6931561