• DocumentCode
    128822
  • Title

    3D atomistic simulations of bulk, FDSOI and Fin FETs sensitivity to oxide reliability

  • Author

    Gerrer, Louis ; Amoroso, S. ; Hussin, R. ; Adamu-Lema, F. ; Asenov, Asen

  • Author_Institution
    Device Modelling Group, Univ. of Glasgow, Glasgow, UK
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    93
  • Lastpage
    96
  • Abstract
    New architectures introduction succeeded in reducing the device performances dispersion in scaled transistors, but as a consequence the relative importance of oxide reliability increased. In this work we present original results of charged interface traps impact on bulk, FDSOI and Fin FETs performances. Traps time constants are analyzed and recoverable and permanent degradation proportions are derived. Finally transistors parameters dispersion increase with time are simulated demonstrating our simulator ability to provide accurate reliability predictions for these three architectures.
  • Keywords
    MOSFET; electronic engineering computing; elemental semiconductors; interface states; semiconductor device models; semiconductor device reliability; silicon-on-insulator; 3D atomistic simulation; FDSOI FET; Fin FET; Si; bulk FET; charged interface trap; oxide reliability; Dispersion; FinFETs; Integrated circuit reliability; Logic gates; Bias Temperature Instabilities; FDSOI; FinFET; Reliability; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931571
  • Filename
    6931571