DocumentCode :
128822
Title :
3D atomistic simulations of bulk, FDSOI and Fin FETs sensitivity to oxide reliability
Author :
Gerrer, Louis ; Amoroso, S. ; Hussin, R. ; Adamu-Lema, F. ; Asenov, Asen
Author_Institution :
Device Modelling Group, Univ. of Glasgow, Glasgow, UK
fYear :
2014
fDate :
9-11 Sept. 2014
Firstpage :
93
Lastpage :
96
Abstract :
New architectures introduction succeeded in reducing the device performances dispersion in scaled transistors, but as a consequence the relative importance of oxide reliability increased. In this work we present original results of charged interface traps impact on bulk, FDSOI and Fin FETs performances. Traps time constants are analyzed and recoverable and permanent degradation proportions are derived. Finally transistors parameters dispersion increase with time are simulated demonstrating our simulator ability to provide accurate reliability predictions for these three architectures.
Keywords :
MOSFET; electronic engineering computing; elemental semiconductors; interface states; semiconductor device models; semiconductor device reliability; silicon-on-insulator; 3D atomistic simulation; FDSOI FET; Fin FET; Si; bulk FET; charged interface trap; oxide reliability; Dispersion; FinFETs; Integrated circuit reliability; Logic gates; Bias Temperature Instabilities; FDSOI; FinFET; Reliability; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location :
Yokohama
ISSN :
1946-1569
Print_ISBN :
978-1-4799-5287-8
Type :
conf
DOI :
10.1109/SISPAD.2014.6931571
Filename :
6931571
Link To Document :
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