DocumentCode
128822
Title
3D atomistic simulations of bulk, FDSOI and Fin FETs sensitivity to oxide reliability
Author
Gerrer, Louis ; Amoroso, S. ; Hussin, R. ; Adamu-Lema, F. ; Asenov, Asen
Author_Institution
Device Modelling Group, Univ. of Glasgow, Glasgow, UK
fYear
2014
fDate
9-11 Sept. 2014
Firstpage
93
Lastpage
96
Abstract
New architectures introduction succeeded in reducing the device performances dispersion in scaled transistors, but as a consequence the relative importance of oxide reliability increased. In this work we present original results of charged interface traps impact on bulk, FDSOI and Fin FETs performances. Traps time constants are analyzed and recoverable and permanent degradation proportions are derived. Finally transistors parameters dispersion increase with time are simulated demonstrating our simulator ability to provide accurate reliability predictions for these three architectures.
Keywords
MOSFET; electronic engineering computing; elemental semiconductors; interface states; semiconductor device models; semiconductor device reliability; silicon-on-insulator; 3D atomistic simulation; FDSOI FET; Fin FET; Si; bulk FET; charged interface trap; oxide reliability; Dispersion; FinFETs; Integrated circuit reliability; Logic gates; Bias Temperature Instabilities; FDSOI; FinFET; Reliability; simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location
Yokohama
ISSN
1946-1569
Print_ISBN
978-1-4799-5287-8
Type
conf
DOI
10.1109/SISPAD.2014.6931571
Filename
6931571
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