DocumentCode :
128825
Title :
Experimental and theoretical investigation of the ‘apparent’ mobility degradation in Bulk and UTBB-FDSOI devices: A focus on the near-spacer-region resistance
Author :
Rideau, D. ; Monsieur, F. ; Nier, O. ; Niquet, Y.M. ; Lacord, J. ; Quenette, V. ; Mugny, G. ; Hiblot, Gaspard ; Gouget, G. ; Quoirin, M. ; Silvestri, L. ; Nallet, F. ; Tavernier, C. ; Jaouen, H.
Author_Institution :
STMicroelectron., Crolles, France
fYear :
2014
fDate :
9-11 Sept. 2014
Firstpage :
101
Lastpage :
104
Abstract :
This paper investigates the mobility `apparent´ channel length dependency in nanometric devices. Based on a series of current and capacitance measurements, we report clear (VG)-1 dependencies of the access resistance in Bulk but also in FDSOI devices. We show that the μeff-Leff degradation observed at small L can be inferred from this gate-bias dependency. By means of numerical simulation, we show that in the near-spacer-region injection velocity saturation occurs and the spreading resistance exhibits a (VG)-1 dependency. A comparison between Bulk and FDSOI devices clearly shows that even in the absence of LDD-counter-doping (pocket), and channel doping, the near-spacer-region resistance is far to be negligible and can contribute up to ~30% of the total resistance (rTOT =VD/IDS) of a ~22nm device.
Keywords :
electric resistance; nanoelectronics; semiconductor devices; silicon-on-insulator; Si; UTBB-FDSOI devices; access resistance; apparent mobility degradation; bulk devices; gate-bias dependency; mobility apparent channel length dependency; nanometric devices; near-spacer-region injection velocity saturation; near-spacer-region resistance; spreading resistance; Degradation; Hydrodynamics; Logic gates; MOS devices; Nanoscale devices; Resistance; Semiconductor process modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location :
Yokohama
ISSN :
1946-1569
Print_ISBN :
978-1-4799-5287-8
Type :
conf
DOI :
10.1109/SISPAD.2014.6931573
Filename :
6931573
Link To Document :
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