• DocumentCode
    1288515
  • Title

    Modeling ceramic filled polymer integrated capacitor formation using neural networks

  • Author

    Thongvigitmanee, Thongchai ; May, Gary S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    22
  • Issue
    4
  • fYear
    1999
  • fDate
    10/1/1999 12:00:00 AM
  • Firstpage
    314
  • Lastpage
    318
  • Abstract
    Integrated decoupling capacitors for MCM-L/D technology are an important component for next-generation electronic packaging applications. This paper presents a statistically designed experiment for systematic characterization of the dielectric constant and loss tangent of integrated capacitors formed by mixing lead magnesium niobate (PMN) particles into polyimide and benzocyclobutene (BCB) polymer dielectric layers. We determine these quantities as a function of the type of polymer material, a volume fraction of ceramic in the polymer matrix, a polymer cure time, and polymer cure temperature. These factors have been examined by means of a D-optimal experiment. Results indicate manipulation of each of the four factors over the ranges examined lead to considerable variation in dielectric constant and loss tangent. Based on data from these experiments, we train neural networks to model this process variation as a function of above variables. Using this methodology, we determine proper combinations of polymer/ceramic materials and processing conditions to achieve desirable electrical properties
  • Keywords
    ceramic capacitors; dielectric losses; electronic engineering computing; filled polymers; modelling; multichip modules; neural nets; permittivity; thin film capacitors; D-optimal experiment; MCM-L/D technology; PdMgNbO3; benzocyclobutene; capacitor formation modelling; ceramic filled polymer integrated capacitor formation; ceramic volume fraction; dielectric constant; electrical properties; electronic packaging; integrated decoupling capacitors; lead magnesium niobate particles; loss tangent; neural networks; polyimide; polymer cure temperature; polymer cure time; polymer dielectric layers; polymer matrix; polymer/ceramic material combination; processing conditions; statistically designed experiment; Capacitors; Ceramics; Dielectric constant; Dielectric losses; Dielectric materials; Electronics packaging; Magnesium; Niobium compounds; Polyimides; Polymers;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/6104.816101
  • Filename
    816101