• DocumentCode
    128853
  • Title

    Extraction of quasi-ballistic transport parameters in Si double-gate MOSFETs based on Monte Carlo method

  • Author

    Ishida, Ryoya ; Koba, Shun ; Tsuchiya, Hideaki ; Kamakura, Yoshinari ; Mori, Nobuya ; Uno, S. ; Ogawa, Michiko

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Kobe Univ., Kobe, Japan
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    153
  • Lastpage
    156
  • Abstract
    In this study, we have developed an evaluation tool of quasi-ballistic transport parameters in realistic devices, to clarify practical benefits of downscaling MOSFETs into ultimate physical scaling limit. It is found that ballistic transport in double-gate (DG) MOSFETs is enhanced due to the channel length (Lch) scaling until Lch = 10 nm, but when Lch is further scaled to less than 10 nm using TSi = Lch/3 scaling rule, where TSi is the channel thickness, surface roughness scattering intensified by spatial fluctuation of quantized subbands drastically degrades ballistic transport. Furthermore, on-current increase or decrease of ultra-scaled DG MOSFETs is found to be basically determined by a backscattering coefficient R. Gate and drain bias voltage dependencies of ballisticity are also evaluated.
  • Keywords
    MOSFET; Monte Carlo methods; ballistic transport; elemental semiconductors; semiconductor device models; silicon; surface roughness; Monte Carlo method; Si; backscattering coefficient; channel length scaling; channel thickness; double-gate MOSFET; drain bias voltage dependencies; quasiballistic transport parameters; spatial fluctuation; surface roughness scattering; ultimate physical scaling limit; ultra-scaled DG MOSFET; Backscatter; Ballistic transport; Kinetic energy; Logic gates; MOSFET; Scattering; Silicon; Monte Carlo simulation; backscattering coefficient; quasi-ballistic transport; scaling; surface roughness scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931586
  • Filename
    6931586