DocumentCode :
1288760
Title :
Feed-Through Type Multilayer Capacitor for High Frequency Voltage Noise Suppression
Author :
Lee, Byoung Hwa ; Park, Min Cheol ; Park, Dong Seok ; Park, Sang Soo ; Ahn, Young Ghyu
Author_Institution :
LCR Div., Samsung Electro-Mech. Co., Ltd., Suwon, South Korea
Volume :
19
Issue :
12
fYear :
2009
Firstpage :
798
Lastpage :
800
Abstract :
A novel feed-through type multilayer ceramic capacitor (MLCC) is proposed using vertically oriented internal electrodes. The proposed capacitor has a distinctive structure to effectively reduce the parasitic equivalent series inductance (ESL), and thus the noise suppression performance of the capacitor can be greatly improved. Furthermore, it can be made compact with the help of relatively simple terminal structure. Therefore, the capacitor developed here is suitably used as a bypass capacitor in mobile communication systems where miniaturized components with high performance are essentially required. To demonstrate the feasibility and validity of the proposed capacitor, the size 1005 capacitors and evaluation boards have been designed and fabricated. According to the measured results, the proposed capacitor provides the insertion loss of 47.5 dB at 1.0 GHz, and thus the peak to peak voltage noise is reduced from 352 mV to 287 mV by using the proposed capacitor instead of using the regular two terminal MLCC.
Keywords :
ceramic capacitors; mobile communication; feed-through type multilayer capacitor; frequency 1.0 GHz; high frequency voltage noise suppression; loss 47.5 dB; mobile communication systems; multilayer ceramic capacitor; parasitic equivalent series inductance; vertically oriented internal electrodes; voltage 287 mV; voltage 352 mV; Capacitors; Ceramics; Electrodes; Frequency; Inductance; Loss measurement; Mobile communication; Noise reduction; Nonhomogeneous media; Voltage; Bypass capacitor; feed-through type multilayer ceramic capacitor (MLCC); noise suppression; parasitic equivalent series inductance (ESL);
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2009.2033510
Filename :
5320201
Link To Document :
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