DocumentCode :
128885
Title :
Predictive modeling of pattern-dependent etch effects in large-area fully-integrated 3D virtual fabrication
Author :
Fried, Daniel ; Greiner, K. ; Faken, D. ; Kamon, M. ; Pap, A. ; Patz, R. ; Stock, Michiel ; Lehto, J. ; Breit, S.
Author_Institution :
Coventor, Inc., Waltham, MA, USA
fYear :
2014
fDate :
9-11 Sept. 2014
Firstpage :
209
Lastpage :
212
Abstract :
We present a predictive modeling approach for pattern-dependent etch processes implemented in a 3D virtual fabrication software platform. This technique combines long-range effects using design data and short-range effects using predictive 3D models of the design-technology interaction. For the first time, this type of pattern-dependent predictive capability is integrated into a full 3D virtual fabrication environment to enable fast accurate structural modeling of complex advanced technologies such as FinFETs, 3D memory and BEOL interconnect.
Keywords :
semiconductor device models; large area fully integrated 3D virtual fabrication; long range effects; pattern dependent etch effects; pattern dependent predictive capability; predictive modeling; short range effects; structural modeling; Arrays; Calibration; Computational modeling; Fabrication; Layout; Solid modeling; Three-dimensional displays; 3D; design-technology interaction; etch; pattern-dependent; process modeling; virtual fabrication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location :
Yokohama
ISSN :
1946-1569
Print_ISBN :
978-1-4799-5287-8
Type :
conf
DOI :
10.1109/SISPAD.2014.6931600
Filename :
6931600
Link To Document :
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