• DocumentCode
    128885
  • Title

    Predictive modeling of pattern-dependent etch effects in large-area fully-integrated 3D virtual fabrication

  • Author

    Fried, Daniel ; Greiner, K. ; Faken, D. ; Kamon, M. ; Pap, A. ; Patz, R. ; Stock, Michiel ; Lehto, J. ; Breit, S.

  • Author_Institution
    Coventor, Inc., Waltham, MA, USA
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    209
  • Lastpage
    212
  • Abstract
    We present a predictive modeling approach for pattern-dependent etch processes implemented in a 3D virtual fabrication software platform. This technique combines long-range effects using design data and short-range effects using predictive 3D models of the design-technology interaction. For the first time, this type of pattern-dependent predictive capability is integrated into a full 3D virtual fabrication environment to enable fast accurate structural modeling of complex advanced technologies such as FinFETs, 3D memory and BEOL interconnect.
  • Keywords
    semiconductor device models; large area fully integrated 3D virtual fabrication; long range effects; pattern dependent etch effects; pattern dependent predictive capability; predictive modeling; short range effects; structural modeling; Arrays; Calibration; Computational modeling; Fabrication; Layout; Solid modeling; Three-dimensional displays; 3D; design-technology interaction; etch; pattern-dependent; process modeling; virtual fabrication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
  • Conference_Location
    Yokohama
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4799-5287-8
  • Type

    conf

  • DOI
    10.1109/SISPAD.2014.6931600
  • Filename
    6931600