DocumentCode :
128922
Title :
The impact of fin/sidewall/gate line edge roughness on trapezoidal bulk FinFET devices
Author :
Wen-Tsung Huang ; Yiming Li
Author_Institution :
Parallel & Sci. Comput. Lab., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2014
fDate :
9-11 Sept. 2014
Firstpage :
281
Lastpage :
284
Abstract :
In this work, the DC characteristic variability of 14-nm-gate HKMG trapezoidal bulk FinFET induced by different line edge roughness (LER) is for the first time studied by using experimentally validated 3D device simulation. By considering a time-domain Gaussian noise function, we compare four types of LER: Fin-LER inclusive of resist-LER and spacer-LER, sidewall-LER, and gate-LER for the trapezoidal bulk FinFET with respect to different fin angles. The resist-LER and sidewall-LER have large impact on characteristics fluctuation. For each type of LER, the Vth fluctuation is comparable among fin angles.
Keywords :
Gaussian noise; MOSFET; semiconductor device models; time-domain analysis; 3D device simulation; DC characteristic variability; Fin-LER; HKMG trapezoidal bulk FinFET; fin angles; fin-sidewall-gate line edge roughness; gate-LER; resist-LER; sidewall-LER; size 14 nm; spacer-LER; time-domain Gaussian noise function; trapezoidal bulk FinFET devices; FinFETs; Fluctuations; Logic gates; Rough surfaces; Sensitivity; Surface roughness; fin-LER; gateLER; line edge roughness; sidewall-LER; trapezoidal bulk FinFET;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
Conference_Location :
Yokohama
ISSN :
1946-1569
Print_ISBN :
978-1-4799-5287-8
Type :
conf
DOI :
10.1109/SISPAD.2014.6931618
Filename :
6931618
Link To Document :
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