Package geometric aware thermal analysis by infrared-radiation thermal images

Since packages affect the amount of heat transfer, it is important to include package and heat sink in thermal analysis. In this paper, we study the full-chip thermal response with different packages. We first discuss the difficulties of obtaining accurate package models for simulation. To facilitate a designer to perform thermal simulation with different packages, we propose to use a matrix called the package-transfer matrix which can transform a temperature profile of one package to another temperature profile of the desired package. To estimate and verify a package-transfer matrix, we propose an efficient method which uses Infrared Radiation (IR) images from two carefully design test chips with PBGA packages. Our experimental results show that the default package model CBGA in HotSpot can be accurately transferred to any other package through the package-transfer matrix.