Title :
Technical progress of EMI shielding materials in Japan
Author :
Yasufuku, Sachio
Author_Institution :
Dept. of Electr. Eng., Tokyo Denki Univ., Japan
Abstract :
Increased usage of thermoplastic materials in electronic apparatus has accentuated electromagnetic interference (EMI) problems. Methods for providing shielding by metallizing the thermoplastics using electroconductive paints and electroconductive thermoplastic molding compounds are examined, following a review of the fundamentals of electromagnetic wave shielding. The characteristics of the commonly used paints and compounds, as well as those of some miscellaneous materials, are discussed. The status of EMI shielding materials in Japan is described.<>
Keywords :
electromagnetic interference; protective coatings; shielding; EMI shielding materials; Japan; electroconductive paints; electroconductive thermoplastic molding compounds; electromagnetic interference; electromagnetic wave shielding; metallic surface coatings; Conducting materials; Councils; Electromagnetic interference; Electromagnetic scattering; Inorganic materials; Paints; Plastics; Protection; Spraying; Vacuum technology;
Journal_Title :
Electrical Insulation Magazine, IEEE
