DocumentCode
128964
Title
Mission profile aware IC design — A case study
Author
Jerke, Goran ; Kahng, Andrew
Author_Institution
Automotive Electron. Div., Robert Bosch GmbH, Reutlingen, Germany
fYear
2014
fDate
24-28 March 2014
Firstpage
1
Lastpage
6
Abstract
Consistent consideration of mission profiles throughout a supply chain is essential for the development of robust electronic components. Consideration of mission profiles is still mainly a manual task today despite rapidly decreasing robustness margins in modern automotive semiconductor technologies. Mission profile awareness aids the automation of robustness aware design by formalizing and partially automating the generation, transformation, propagation and usage of all component-specific functional loads and environmental conditions for design implementation and validation. In addition, it aids the development of electronic components in yet immature technologies or in technologies with tight parameter variation bounds. This paper introduces the general concept, requirements and context of mission profile aware design. The general design approach is presented along with key differences and enhancements to existing design approaches. A case study focusing on mission profile usage and electromigration failure avoidance is presented to demonstrate various aspects of mission profile aware design.
Keywords
electromigration; failure analysis; integrated circuit design; monolithic integrated circuits; automotive semiconductor technologies; electromigration failure avoidance; mission profile aware IC design; parameter variation bounds; robust electronic components; robustness aware design; supply chain; Automotive engineering; Current density; Electromigration; Integrated circuits; Robustness; Supply chains; Electromigration; IC Design; Mission Profile; Mission Profile Aware Design; Reliability; Robustness; Validation; Verification;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location
Dresden
Type
conf
DOI
10.7873/DATE.2014.077
Filename
6800278
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