• DocumentCode
    128964
  • Title

    Mission profile aware IC design — A case study

  • Author

    Jerke, Goran ; Kahng, Andrew

  • Author_Institution
    Automotive Electron. Div., Robert Bosch GmbH, Reutlingen, Germany
  • fYear
    2014
  • fDate
    24-28 March 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Consistent consideration of mission profiles throughout a supply chain is essential for the development of robust electronic components. Consideration of mission profiles is still mainly a manual task today despite rapidly decreasing robustness margins in modern automotive semiconductor technologies. Mission profile awareness aids the automation of robustness aware design by formalizing and partially automating the generation, transformation, propagation and usage of all component-specific functional loads and environmental conditions for design implementation and validation. In addition, it aids the development of electronic components in yet immature technologies or in technologies with tight parameter variation bounds. This paper introduces the general concept, requirements and context of mission profile aware design. The general design approach is presented along with key differences and enhancements to existing design approaches. A case study focusing on mission profile usage and electromigration failure avoidance is presented to demonstrate various aspects of mission profile aware design.
  • Keywords
    electromigration; failure analysis; integrated circuit design; monolithic integrated circuits; automotive semiconductor technologies; electromigration failure avoidance; mission profile aware IC design; parameter variation bounds; robust electronic components; robustness aware design; supply chain; Automotive engineering; Current density; Electromigration; Integrated circuits; Robustness; Supply chains; Electromigration; IC Design; Mission Profile; Mission Profile Aware Design; Reliability; Robustness; Validation; Verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
  • Conference_Location
    Dresden
  • Type

    conf

  • DOI
    10.7873/DATE.2014.077
  • Filename
    6800278