Integration of vapor deposited polyimide into a multichip module packaging process

Author

Liberman, Vladimir ; Malba, Vincent ; Bernhardt, Anthony F.

Author_Institution

Lawrence Livermore Nat. Lab., CA, USA

Volume

20

Issue

1

fYear

1997

fDate

2/1/1997 12:00:00 AM

Firstpage

13

Lastpage

16

Abstract

We report the first full integration of a vapor-deposited polyimide dielectric into a multichip module (MCM) electronic packaging scheme. A robust high-throughput vapor deposition polymerization (VDP) of polyimide has been developed for an interconnection scheme in which thin film metal interconnects are patterned from the top of bare die, down the sides, and onto the substrate circuit board surface. VDP polyimides films have been extensively characterized using infrared spectroscopy and prism coupling techniques. The chemical and electrical properties of the VDP polyimide films are similar to commercially available spin cast polyimides

Keywords

infrared spectra; multichip modules; polymer films; polymerisation; vapour deposited coatings; chemical properties; electrical properties; electronic packaging; infrared spectroscopy; multichip module; polyimides film dielectric; prism coupling; thin film metal interconnect; vapor deposition polymerization; Chemical vapor deposition; Dielectric substrates; Dielectric thin films; Electronics packaging; Integrated circuit interconnections; Multichip modules; Polyimides; Polymer films; Robustness; Thin film circuits;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.554454

Filename

554454