• DocumentCode
    1289974
  • Title

    Exploiting structure in fast aerial image computation for integrated circuit patterns

  • Author

    Pati, Y.C. ; Ghazanfarian, Amir Aalam ; Pease, R. Fabian

  • Author_Institution
    Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
  • Volume
    10
  • Issue
    1
  • fYear
    1997
  • fDate
    2/1/1997 12:00:00 AM
  • Firstpage
    62
  • Lastpage
    74
  • Abstract
    Modeling aerial images has recently become a crucial component of semiconductor manufacturing. As all steppers employ partially coherent illumination, such modeling has been computationally intensive for all but elementary patterns. In this paper we describe a fast computational method for calculating aerial images of integrated circuit masks produced by a partially coherent optical projection system. The method described relies on two tools to realize fast computation: (1) coherent decompositions of partially coherent imaging system models as proposed by Pati and Kailath (1994), and (2) the use of “basis” (or building block) images that are well-suited to describe integrated circuit patterns. Examples are presented in which aerial images are computed for large mask areas. The proposed method represents a speed improvement of several orders of magnitude over a more traditional, and more general, approach (SPLAT from the University of California, Berkeley)
  • Keywords
    electronic engineering computing; image processing; integrated circuit manufacture; masks; photolithography; IC masks; fast aerial image computation; fast computational method; integrated circuit patterns; large mask areas; partially coherent illumination; partially coherent optical projection system; semiconductor manufacturing; steppers; Application specific integrated circuits; Automatic optical inspection; Computational modeling; Integrated circuit modeling; Integrated optics; Lighting; Lithography; Optical computing; Optical design; Optical filters;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.554485
  • Filename
    554485