DocumentCode
1290085
Title
Real-time multivariable control of PECVD silicon nitride film properties
Author
Knight, Thomas J. ; Greve, David W. ; Cheng, Xu ; Krogh, Bruce H.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume
10
Issue
1
fYear
1997
fDate
2/1/1997 12:00:00 AM
Firstpage
137
Lastpage
146
Abstract
This paper reports on the application of quadrupole mass spectrometry (QMS) sensing to real-time multivariable control of film properties in a plasma-enhanced CVD silicon nitride process. Process variables believed to be most important to film deposition are defined (i.e., disilane pressure, triaminosilane pressure, and dc bias voltage) and their responses to system inputs are modeled experimentally. Then, a real-time controller uses this information to manipulate the process variables and hence film performance in real time during film deposition. The relationships between gas concentrations and film performance are shown explicitly where the controller was used to drive the concentrations to constant setpoints. Also, an experiment investigating the effects of an out-of-calibration mass flow controller demonstrates the compensating ability of the real-time controller. The results indicate that in situ sensor-based control using quadrupole mass spectrometry can significantly assist in optimizing film properties, reducing drift during a run, reducing run-to-run drift, creating a better understanding of the process, and making the system tolerant to disturbances
Keywords
insulating thin films; mass spectrometer applications; multivariable control systems; plasma CVD; process control; real-time systems; silicon compounds; SiN; in situ sensing; mass flow controller; plasma-enhanced CVD; quadrupole mass spectrometry; real-time multivariable control; silicon nitride film; Etching; Feedback; Mass spectroscopy; Monitoring; Plasma properties; Process control; Radiofrequency identification; Semiconductor films; Silicon; Weight control;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.554500
Filename
554500
Link To Document