DocumentCode :
129034
Title :
Temperature aware energy-reliability trade-offs for mapping of throughput-constrained applications on multimedia MPSoCs
Author :
Das, Aruneema ; Kumar, Ajit ; Veeravalli, Bharadwaj
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
fYear :
2014
fDate :
24-28 March 2014
Firstpage :
1
Lastpage :
6
Abstract :
This paper proposes a design-time (offline) analysis technique to determine application task mapping and scheduling on a multiprocessor system and the voltage and frequency levels of all cores (offline DVFS) that minimize application computation and communication energy, simultaneously minimizing processor aging. The proposed technique incorporates (1) the effect of the voltage and frequency on the temperature of a core; (2) the effect of neighboring cores´ voltage and frequency on the temperature (spatial effect); (3) pipelined execution and cyclic dependencies among tasks; and (4) the communication energy component which often constitutes a significant fraction of the total energy for multimedia applications. The temperature model proposed here can be easily integrated in the design space exploration for multiprocessor systems. Experiments conducted with MPEG-4 decoder on a real system demonstrate that the temperature using the proposed model is within 5% of the actual temperature clearly demonstrating its accuracy. Further, the overall optimization technique achieves 40% savings in energy consumption with 6% increase in system lifetime.
Keywords :
integrated circuit reliability; multimedia communication; optimisation; system-on-chip; MPEG-4 decoder; application task mapping; communication energy component; cyclic dependencies; design space exploration; design-time analysis technique; energy consumption; frequency levels; multimedia MPSoC; multiprocessor systems-on-chip; offline DVFS; offline analysis technique; optimization technique; pipelined execution; processor aging minimization; spatial effect; temperature aware energy-reliability trade-offs; temperature model; throughput-constrained application mapping; voltage levels; Equations; Mathematical model; Multimedia communication; Reliability; Temperature dependence; Temperature sensors; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location :
Dresden
Type :
conf
DOI :
10.7873/DATE.2014.115
Filename :
6800316
Link To Document :
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