DocumentCode :
129038
Title :
Development of a high temperature transducer backing element with porous ceramics
Author :
Amini, Mohammad Hossein ; Sinclair, Anthony N. ; Coyle, Thomas W.
Author_Institution :
Mech. & Ind. Eng. Dept., Univ. of Toronto, Toronto, ON, Canada
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
967
Lastpage :
970
Abstract :
In this study, porous ceramics are introduced as a backing element suitable for high temperature transducers. Acoustic impedance and attenuation can be regulated through control of the porosity and pore size, using scattering from micropores as the attenuation mechanism. Porosity is induced by mixing the ceramic powder with polyethylene particles. The polymer component burns during the sintering process and leaves behind spherical voids. Porosity and pore size are controlled through the polymer-to-ceramic weight ratio and poltyethylene particle size, respectively. In this manner, a porous mullite material is designed and manufactured to act as the binding agent for a gallium phosphate (GaPO4) piezocrystal; this yields our goal of a wide-band signal with center frequency of 2.8 MHz and operating temperature up to 700 - 800 °C. The design and fabrication process can be employed in manufacturing backing elements for a variety of transducers with specified center frequency and signal bandwidth.
Keywords :
acoustic impedance; aluminium compounds; ceramics; high-temperature effects; particle size; silicon compounds; ultrasonic absorption; ultrasonic transducers; Al2O3-SiO2; acoustic attenuation mechanism; acoustic impedance; ceramic powder; gallium phosphate piezocrystal; high temperature ultrasonic transducer backing element; mixing; poltyethylene particle size; polyethylene particles; polymer-to-ceramic weight ratio; pore size; porosity; porous ceramics; porous mullite material; scattering; signal bandwidth; sintering; temperature 700 degC to 800 degC; wide-band signal; Acoustics; Attenuation; Ceramics; Impedance; Scattering; Transducers; High temperature ultrasonic transducer; backing element; ceramic manufacturing; porous ceramics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0237
Filename :
6931757
Link To Document :
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