DocumentCode :
1290431
Title :
Electronic failure analysis handbook: techniques and applications for electronic and electrical packages, components, and assemblies [Book Reviews]
Author :
Shea, John
Volume :
16
Issue :
1
fYear :
2000
Firstpage :
72
Lastpage :
72
Keywords :
Assembly; Books; Ceramics; Composite materials; Electronics packaging; Failure analysis; Libraries; Polymers; Product liability; Tires;
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2000.817421
Filename :
817421
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1290431