Title :
Explosive Electron Emission Ignition at the “W-Fuzz” Surface Under Plasma Power Load
Author :
Barengolts, Sergey A. ; Mesyats, Gennady A. ; Tsventoukh, Mikhail M.
Author_Institution :
Prokhorov Gen. Phys. Inst., Russian Acad. of Sci., Moscow, Russia
Abstract :
The essentially nonstationary explosivelike character of erosion-emission processes was revealed by analyzing the plasma action onto a nanostructured W-fuzz surface. It was found that such a fine structure of the surface promotes a local ecton-process ignition by plasma action. The dense W-plasma production time is much less than that of a typical fusion-device first-wall transient-event edge localized mode (ELM) power load. The W-plasma density substantially exceeds that of the incident plasma and leads to intense growth of the electric field and strong emission buildup. Therefore, at the ELM power load, the electric field and emission current density (in the W-plasma-wall sheath) can achieve tens of megavolts per centimeter and 100 MA/cm2 or higher due to collective processes driven by an intense emission beam. The strong volume heating by Joule energy release occurs due to the intense emission current density that leads to electric explosion of other W-fuzz nanowire layers.
Keywords :
electron emission; explosions; ignition; nanowires; plasma boundary layers; plasma density; plasma materials processing; plasma sheaths; plasma-wall interactions; tungsten; W; W-fuzz nanowire layers; W-plasma density; W-plasma-wall sheath; dense W-plasma production time; electric field growth; erosion-emission process; explosive electron emission ignition; fusion-device first-wall transient-event edge localized mode; intense emission current density; nanostructured W-fuzz surface; nonstationary explosivelike characteristics; plasma power load; Current density; Explosives; Ignition; Ionization; Physics; Plasmas; Tungsten; Arcing; ectons; explosive electron emission (EEE) initiation; fusion-device first wall; plasma-surface interactions;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2011.2159996