Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors

Author

Deutsch, Alina ; Surovic, Christopher W. ; Campbell, Jeffrey S. ; Coteus, Paul W. ; Lanzetta, Alphonso P. ; Holton, James T. ; Knight, Alan D.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

20

Issue

1

fYear

1997

fDate

2/1/1997 12:00:00 AM

Firstpage

64

Lastpage

77

Abstract

Two types of high-performance, high-density connectors, pin-in-socket, and pad-on-pad, are investigated for providing many hundreds of signal contacts in large-panel, card-to-board applications. The two examples were selected as top-of-the-line contenders for mechanically robust interconnections that can be used for transmitting 500 Mb/s and even 1 Gb/s data-rate signals, and with comparable cost. While the pinned connector offers a proven technology, the newly introduced pad-on-pad connector can provide at least 1.5 times higher number of signal contacts and lower crosstalk. Experimental characterization of signal integrity, connector delay, impedance discontinuity, crosstalk, and maximum current capability, is performed for both connectors in order to compare their relative performance

Keywords

crosstalk; delays; electric connectors; electric impedance; printed circuit accessories; 500 Mbit/s to 1 Gbit/s; card-to-board applications; connector delay; crosstalk; electrical characteristics; high-density connectors; high-performance type; impedance discontinuity; maximum current capability; pad-on-pad connectors; pin-in-socket connector; signal integrity; Connectors; Contacts; Crosstalk; Driver circuits; Electric variables; Integrated circuit interconnections; LAN interconnection; Packaging; Robustness; Wiring;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.554529

Filename

554529