Title :
Reliability of the laminate from advanced COPNA-resin/E-glass fabrics system
Author :
Nawa, Kazunari ; Ohkita, Masakazu
Author_Institution :
Res. & Dev. Center, Sumitomo Metal Ind. Ltd., Amagasaki, Japan
fDate :
2/1/1997 12:00:00 AM
Abstract :
Reliability of the advanced COPNA-resin laminate which exhibited high glass transition temperature (Tg) at 255°C, low coefficient of thermal expansion (CTE) at 5-7 ppm (xy-axis) and at 29 ppm (x-axis) was evaluated by temperature-humidity-bias (THB) test, pressure-cooker (PC) test, heat-shock test, heat-cycle test, and conductive anodic filaments (CAF) test. The laminate exhibited higher reliability than the FR-4 graded epoxy-resin laminate in every test, and exhibited higher reliability than the bismaleimide-triazine resin laminate in the THB test, heat-shock test, and heat-cycle test. The high reliability of the advanced COPNA-resin system is considered to be due to its high Tg and small CTE. In this paper, low CTEs of the advanced COPNA-resin laminate are also theoretically studied by using a model for uni-axially reinforced composites
Keywords :
glass transition; laminates; packaging; reliability; thermal expansion; 225 C; COPNA-resin/E-Glass fabrics system; CTE; THB test; advanced COPNA-resin laminate; conductive anodic filaments test; heat-cycle test; heat-shock test; high reliability composite; model; pressure-cooker test; reliability testing; temperature-humidity-bias test; thermal expansion coefficient; uni-axially reinforced composites; Chip scale packaging; Electronic packaging thermal management; Fabrics; Laminates; Large scale integration; Resins; Soldering; System testing; Thermal expansion; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
