• DocumentCode
    129100
  • Title

    Modelling elastic wave propagation using the k-Wave MATLAB Toolbox

  • Author

    Treeby, B.E. ; Jaros, Jiri ; Rohrbach, Daniel ; Cox, B.T.

  • Author_Institution
    Dept. of Med. Phys. & Biomed. Eng., Univ. Coll. London, London, UK
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    146
  • Lastpage
    149
  • Abstract
    A new model for simulating elastic wave propagation using the open-source k-Wave MATLAB Toolbox is described. The model is based on two coupled first-order equations describing the stress and particle velocity within an isotropic medium. For absorbing media, the Kelvin-Voigt model of viscoelasticity is used. The equations are discretised in 2D and 3D using an efficient time-stepping pseudospectral scheme. This uses the Fourier collocation spectral method to compute spatial derivatives and a leapfrog finite-difference scheme to integrate forwards in time. A multi-axial perfectly matched layer (M-PML) is implemented to allow free-field simulations using a finite-sized computational grid. Acceleration using a graphics processing unit (GPU) is supported via the MATLAB Parallel Computing Toolbox. An overview of the simulation functions and their theoretical and numerical foundations is described.
  • Keywords
    finite difference methods; graphics processing units; mathematics computing; ultrasonic propagation; Fourier collocation spectral method; Kelvin-Voigt model; MATLAB Parallel Computing Toolbox; coupled first order equations; elastic wave propagation; finite sized computational grid; graphics processing unit; isotropic medium; k-Wave MATLAB Toolbox; leapfrog finite difference scheme; multiaxial perfectly matched layer; open source toolbox; particle velocity; time stepping pseudospectral scheme; viscoelasticity; Absorption; Biological system modeling; Computational modeling; MATLAB; Mathematical model; Numerical models; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0037
  • Filename
    6931789