DocumentCode :
1291388
Title :
A unified simulation of Schottky and ohmic contacts
Author :
Matsuzawa, Kazuya ; Uchida, Ken ; Nishiyama, Akira
Author_Institution :
Adv. LSI Technol. Lab., Toshiba Corp., Yokohama, Japan
Volume :
47
Issue :
1
fYear :
2000
fDate :
1/1/2000 12:00:00 AM
Firstpage :
103
Lastpage :
108
Abstract :
The Schottky contact is an important consideration in the development of semiconductor devices. This paper shows that a practical Schottky contact model is available for a unified device simulation of Schottky and ohmic contacts. The present model includes the thermionic emission at the metal/semiconductor interface and the spatially distributed tunneling calculated at each semiconductor around the interface. Simulation results of rectifying characteristics of Schottky barrier diodes (SBD´s) and resistances under high impurity concentration conditions are reasonable, compared with measurements. As examples of application to actual devices, the influence of the contact resistance on salicided MOSFETs with source/drain extension and the immunity of Schottky barrier tunnel transistors (SBTTs) from the short-channel effect (SCE) are demonstrated
Keywords :
MOSFET; Schottky barriers; Schottky diodes; contact resistance; impurity distribution; ohmic contacts; semiconductor device models; solid-state rectifiers; tunnel transistors; tunnelling; Schottky barrier diodes; Schottky contacts; contact model; contact resistance; high impurity concentration conditions; metal/semiconductor interface; ohmic contacts; rectifying characteristics; salicided MOSFETs; short-channel effect; source/drain extension; spatially distributed tunneling; thermionic emission; tunnel transistors; unified simulation; Electrical resistance measurement; MOSFETs; Ohmic contacts; Schottky barriers; Schottky diodes; Semiconductor devices; Semiconductor diodes; Semiconductor impurities; Thermionic emission; Tunneling;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.817574
Filename :
817574
Link To Document :
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