DocumentCode :
129181
Title :
Nanosecond time-resolved thermo-acoustics in refractory metals undergoing laser pulse-induced phase transition: Finite difference modeling
Author :
Veres, Istvan A. ; Utegulov, Zhandos N. ; Every, Arthur E.
Author_Institution :
RECENDT GmbH, Linz, Austria
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
2474
Lastpage :
2477
Abstract :
The presented work investigates the metal-to-liquid phase transition induced by a nanosecond pulsed-laser. The generation and propagation of the elastic waves by the surface thermal source is described by the coupled heat conduction and elastic wave equations and solved using a numerical finite difference time domain (FDTD) technique. During laser-induced melting the molten mass loses its rigidity and the generation of the shear waves is significantly influenced by a shallow melt pool, while the propagation of longitudinal waves remains less influenced. Numerical simulations are carried out to investigate the possibility to detect laser-induced melting in tungsten by utilizing this effect. In particular, the arrival of the shear waves in the epicentral wave form is monitored to detect the presence of molten material.
Keywords :
elastic waves; finite difference time-domain analysis; laser materials processing; melting; pulsed laser deposition; refractories; thermoacoustics; FDTD technique; coupled heat conduction; elastic wave equations; elastic wave generation; elastic wave propagation; epicentral wave form; finite difference modeling; laser pulse-induced phase transition; laser-induced melting; metal-to-liquid phase transition; molten mass; molten material; nanosecond pulsed-laser; nanosecond time-resolved thermo-acoustics; numerical finite difference time domain; numerical simulations; refractory metals; rigidity; shallow melt pool; shear waves; surface thermal source; tungsten; Acoustics; Heating; Laser modes; Materials; Mathematical model; Propagation; Surface waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0617
Filename :
6931829
Link To Document :
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