DocumentCode :
129201
Title :
A single-chip biosensing platform integrating FBAR sensor with digital microfluidic device
Author :
Menglun Zhang ; Weiwei Cui ; Ji Liang ; Daihua Zhang ; Wei Pang ; Hao Zhang
Author_Institution :
State Key Lab. of Precision Meas. Technol. & Instrum., Tianjin Univ., Tianjin, China
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
1521
Lastpage :
1523
Abstract :
Although digital microfluidic system has shown great potential in a wide range of applications, a single-chip platform integrating biochemical sensors with digital microfluidic devices is still lacking. In this paper, film bulk acoustic resonator (FBAR) sensors and electrowetting-on-dielectric (EWOD) actuator are integrated on a single silicon chip, where the EWOD actuator manipulates digital droplets and the FBAR sensor detects analyte in the droplets. Thin aluminum nitride (AlN) film is a critical material as both the FBAR piezoelectric layer and the EWOD dielectric layer, which facilitates the compact integration of the two devices on a chip. A preliminary demonstration of Hg2+ droplet transportation and detection is conducted on the platform. The integrated platform is expected to play an important role in many complex lab-on-a-chip applications in chemistry, biology and medicine.
Keywords :
III-V semiconductors; acoustic resonators; acoustic transducers; aluminium compounds; bioMEMS; biosensors; chemical sensors; lab-on-a-chip; mercury (metal); microfluidics; microsensors; piezoelectric actuators; semiconductor thin films; wide band gap semiconductors; AlN; EWOD dielectric layer; FBAR piezoelectric layer; FBAR sensor; Hg; biochemical sensors; biology; chemistry; digital droplets; digital microfluidic device; droplet transportation; electrowetting-ondielectric actuator; film bulk acoustic resonator; lab-on-achip applications; medicine; single-chip biosensing platform; thin aluminum nitride film; Acoustics; Gold; Silicon; EWOD; FBAR sensor; integration; lab-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0376
Filename :
6931839
Link To Document :
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