• DocumentCode
    1292276
  • Title

    On yield-optimizing design rules

  • Author

    Heavlin, William D. ; Beck, Clark

  • Author_Institution
    Enhansys Inc., Cupertino, CA, USA
  • Volume
    1
  • Issue
    2
  • fYear
    1985
  • fDate
    3/1/1985 12:00:00 AM
  • Firstpage
    7
  • Lastpage
    12
  • Abstract
    Integrated circuit design rules represent a trade-off between the probability that a given die will yield and the physical size of that die. Optimum design rules maximize the average number of good dice on a wafer. The authors present a methodology for calculating design rules that are optimum in this sense. The development involves four points: (1) any design rule can be represented physically by a key-and-target structure; (2) such key-and-target structures lend themselves to suitable mathematical analysis; (3) the average yield of a given ensemble of design rules may be estimated by computer simulation and (4) the most efficient design rules may be estimated by the methods of stochastic optimization.
  • Keywords
    integrated circuit technology; optimisation; probability; stochastic processes; IC technology; die size; key/target structure; physical size; probability; stochastic optimization; yield-optimizing design rules; Equations; Fabrication; Integrated circuits; Layout; Lithography; Mathematical model;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.1985.6311943
  • Filename
    6311943