DocumentCode
1292276
Title
On yield-optimizing design rules
Author
Heavlin, William D. ; Beck, Clark
Author_Institution
Enhansys Inc., Cupertino, CA, USA
Volume
1
Issue
2
fYear
1985
fDate
3/1/1985 12:00:00 AM
Firstpage
7
Lastpage
12
Abstract
Integrated circuit design rules represent a trade-off between the probability that a given die will yield and the physical size of that die. Optimum design rules maximize the average number of good dice on a wafer. The authors present a methodology for calculating design rules that are optimum in this sense. The development involves four points: (1) any design rule can be represented physically by a key-and-target structure; (2) such key-and-target structures lend themselves to suitable mathematical analysis; (3) the average yield of a given ensemble of design rules may be estimated by computer simulation and (4) the most efficient design rules may be estimated by the methods of stochastic optimization.
Keywords
integrated circuit technology; optimisation; probability; stochastic processes; IC technology; die size; key/target structure; physical size; probability; stochastic optimization; yield-optimizing design rules; Equations; Fabrication; Integrated circuits; Layout; Lithography; Mathematical model;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/MCD.1985.6311943
Filename
6311943
Link To Document